CMP, also called thermal oxidation polishing, makes use of MP in conjunction with substances to reinforce the MRR and increase surface high quality [twenty]. Determine 2 illustrates the schematic of a typical CMP process [21]. The SiC wafer, which is fastened about the carrier, and the sharpening pad transfer relative https://www.facebook.com/permalink.php?story_fbid=pfbid02LJ9LkYSgMgGfwHgRv6arAYnVmSddNSiHw67gq6A8nr38NE9q2L4uywTLkZLJD7mMl&id=61560512640678&__cft__[0]=AZXOlqXwSyHZR0_jjQ0zO4hgkRYZ_iixit3fnGpkJ1RpxcsRrXPVm_bWsRPYkGJPS3MpILc6MmzwRZqnLntJ5fb05aM5Sb1CsIGbtxM08zPgcRYrGXg1Sq8Nmc8DlVVndIMYoAMF2Aiwp5j3nm54FP3rQsfkqn1HsWQ1JBtO7ElUiStt0b_RPRdgSggFRGTSm-3VuyMbUo4zgBYx11iawNiI&__tn__=%2CO%2CP-R